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Surface and grain boundary scattering studied in beveled polycrystalline thin copper films

dc.contributor.authorZhang, Wenqi
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorClarysse, Trudo
dc.contributor.authorTerzieva, Valentina
dc.contributor.authorRosseel, Erik
dc.contributor.authorVandervorst, Wilfried
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-15T18:13:51Z
dc.date.available2021-10-15T18:13:51Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9973
dc.sourceIIOimport
dc.titleSurface and grain boundary scattering studied in beveled polycrystalline thin copper films
dc.typeJournal article
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorTerzieva, Valentina
dc.contributor.imecauthorRosseel, Erik
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.source.peerreviewno
dc.source.beginpage1830
dc.source.endpage1833
dc.source.journalJournal of Vacuum Science and Technology B
dc.source.issue4
dc.source.volume22
imec.availabilityPublished - imec


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