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Investigation and characterisation of COB assembly aspects on high power MCM-L substrates

dc.contributor.authorAckaert, Ann
dc.contributor.authorVereecken, M.
dc.contributor.authorForrest, M.
dc.contributor.authorBeyne, Eric
dc.contributor.authorVan De Peer, Myriam
dc.date.accessioned2021-09-29T12:39:39Z
dc.date.available2021-09-29T12:39:39Z
dc.date.issued1994
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9
dc.sourceIIOimport
dc.titleInvestigation and characterisation of COB assembly aspects on high power MCM-L substrates
dc.typeProceedings paper
dc.contributor.imecauthorAckaert, Ann
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan De Peer, Myriam
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage9
dc.source.conference1st European Conference on Electronic Packaging Technology - EUPAC
dc.source.conferencedate01/02/1994
dc.source.conferencelocationEssen Germany
imec.availabilityPublished - open access
imec.internalnotesDVS Berichte; Vol. 158


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