Browsing by Author "Ai, Hua"
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Publication CVD Mn-based self-formed barrier for advanced interconnect technology
Proceedings paper2013, IEEE International Interconnect Technology Conference - IITC, 13/06/2013, p.2.3Publication CVD-Mn(Nx) as copper diffusion barrier for advanced interconnect technologies
Meeting abstract2013, 224th ECS Fall Meeting, 27/10/2013, p.2081