Browsing by Author "Andersson, Dag"
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Publication Package and solder joint reliability analysed by FEM simulation and experiments
; Andersson, DagJournal article2004-12, Microelectronics Reliability, (44) 12, p.1891-1892Publication Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388 PBGA package
Journal article2009, Soldering & Surface Mount Technology, (21) 2, p.28-38