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Package and solder joint reliability analysed by FEM simulation and experiments
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Package and solder joint reliability analysed by FEM simulation and experiments
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Date
2004-12
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandevelde, Bart
;
Andersson, Dag
Journal
Microelectronics Reliability
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1928
since deposited on 2021-10-15
1
last month
Acq. date: 2025-12-15
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Metrics
Views
1928
since deposited on 2021-10-15
1
last month
Acq. date: 2025-12-15
Citations