Publication:
Package and solder joint reliability analysed by FEM simulation and experiments
Date
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.author | Andersson, Dag | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.date.accessioned | 2021-10-15T17:25:37Z | |
| dc.date.available | 2021-10-15T17:25:37Z | |
| dc.date.issued | 2004-12 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/9827 | |
| dc.source.beginpage | 1891 | |
| dc.source.endpage | 1892 | |
| dc.source.issue | 12 | |
| dc.source.journal | Microelectronics Reliability | |
| dc.source.volume | 44 | |
| dc.title | Package and solder joint reliability analysed by FEM simulation and experiments | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |