Browsing by Author "Arnold, Marco"
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Publication Electrochemical deposition of Sn-Cu alloys for applications in 3D stacking in microelectronics industry
Meeting abstract2020, Electrochemical Society Spring Meeting Symposium E03: Electrodeposition of Alloys, Intermetallic Compounds, and Eutectics, 10/05/2020Publication Electrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applications
; ; ; ; Journal article2017, Chip Scale Review, (21) 1, p.28-32Publication Electrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applications
Meeting abstract2016, 13th Annual International Wafer-Level Packaging Conference - IWLPC, 18/10/2016Publication Thermal-Mechanical behavior of highly (111)-oriented Nano Twinned Electroplated copper for advanced electronic packaging
Proceedings paper2025, 75th Electronic Components and Technology Conference (ECTC), 2025-05-27, p.958-964Publication Wafer-Level Electrochemical Deposition and Processing of Nanotwinned Cu RDL
Proceedings paper2024, 2024 International Interconnect Technology Conference, JUN 03-06, 2024