Publication:

Wafer-Level Electrochemical Deposition and Processing of Nanotwinned Cu RDL

Date

2024

Proceedings Paper

https://doi.org/10.1109/IITC61274.2024.10732470

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Author(s)

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Watanabe, Soichi

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Shafahian, Ehsan

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Mudigere Krishne Gowda, Punith

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Struyf, Herbert

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Journal

N/A

Metrics

163 since deposited on 2025-03-06

Acq. date: 2025-12-11