Publication:

Wafer-Level Electrochemical Deposition and Processing of Nanotwinned Cu RDL

Date

2024
Proceedings Paper
https://doi.org/10.1109/IITC61274.2024.10732470
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Author(s)

Hsia, Chih-Hao
;
Park, SungHo
;
Watanabe, Soichi
;
Arnold, Marco
;
El-Mekki, Zaid  
;
Delande, Tinne  
;
Shafahian, Ehsan  
;
Mudigere Krishne Gowda, Punith  
;
Struyf, Herbert  
;
Radisic, Alex  

Journal

N/A

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164 since deposited on 2025-03-06
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164 since deposited on 2025-03-06
1last month
Acq. date: 2026-01-25

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