Browsing by Author "Bai, Dongshun"
Now showing 1 - 2 of 2
- Results Per Page
- Sort Options
Publication Advances in thin wafer debonding and ultra thin 28nm FinFET substrate transfer
Meeting abstract2017, IEEE 67th Electronic Components and Technology Conference - ECTC, 30/05/2017, p.740-745Publication Single-release-layer process for temporary bonding applications in 3D integration area
Proceedings paper2015, IEEE 65th Electronic Components & Technology Conference - ECTC, 26/05/2015, p.896-898