Browsing by Author "Baier, Ulrich"
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Publication Dry etch challenges for implantable silicon-based semi-flexible neural probe fabrication
Oral presentation2011, 4th International Workshop on Plasma Etch and Strip in Microelectronics - PESMPublication Exploring high aspEct ratio 2μm TSV (25:1)
Proceedings paper2011-11, 64th Annual Gaseous Electronics Conference - GEC, 14/11/2011Publication Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers
Proceedings paper2011-06, IEEE 61st Electronic Components and Technology Conference - ECTC, 31/05/2011, p.1384-1388Publication Patterning challenges of optical waveguides for sensing applications
Meeting abstract2012, Micro and Nano Engineering Conference - MNE, 16/09/2012