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Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers
Publication:
Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers
Date
2011-06
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Redolfi, Augusto
;
Velenis, Dimitrios
;
Thangaraju, Sarasvathi
;
Nolmans, Philip
;
Jaenen, Patrick
;
Kostermans, Maarten
;
Baier, Ulrich
;
Van Besien, Els
;
Dekkers, Harold
;
Witters, Thomas
;
Jourdan, Nicolas
;
Van Ammel, Annemie
;
Vandersmissen, Kevin
;
Rodet, Simon
;
Philipsen, Harold
;
Radisic, Alex
;
Heylen, Nancy
;
Travaly, Youssef
;
Swinnen, Bart
;
Beyne, Eric
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1961
since deposited on 2021-10-19
Acq. date: 2025-10-23
Citations
Metrics
Views
1961
since deposited on 2021-10-19
Acq. date: 2025-10-23
Citations