Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers

Redolfi, Augusto; Velenis, Dimitrios; Thangaraju, Sarasvathi; Nolmans, Philip; Jaenen, Patrick; Kostermans, Maarten; Baier, Ulrich; Van Besien, Els; Dekkers, Harold; Witters, Thomas; Jourdan, Nicolas; Van Ammel, Annemie; Vandersmissen, Kevin; Rodet, Simon; Philipsen, Harold; Radisic, Alex; Heylen, Nancy; Travaly, Youssef; Swinnen, Bart; Beyne, Eric

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Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers

Date

2011

Proceedings Paper

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Author(s)

Redolfi, Augusto

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Velenis, Dimitrios

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Thangaraju, Sarasvathi

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Jourdan, Nicolas

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Van Ammel, Annemie

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Vandersmissen, Kevin

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Rodet, Simon

;

Philipsen, Harold

;

Radisic, Alex

;

Heylen, Nancy

;

Travaly, Youssef

;

Swinnen, Bart

;

Beyne, Eric

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Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers

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