Publication:

Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers

Date

2011-06
Proceedings Paper
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dc.contributor.authorRedolfi, Augusto
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorThangaraju, Sarasvathi
dc.contributor.authorNolmans, Philip
dc.contributor.authorJaenen, Patrick
dc.contributor.authorKostermans, Maarten
dc.contributor.authorBaier, Ulrich
dc.contributor.authorVan Besien, Els
dc.contributor.authorDekkers, Harold
dc.contributor.authorWitters, Thomas
dc.contributor.authorJourdan, Nicolas
dc.contributor.authorVan Ammel, Annemie
dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorRodet, Simon
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorRadisic, Alex
dc.contributor.authorHeylen, Nancy
dc.contributor.authorTravaly, Youssef
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorRedolfi, Augusto
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorNolmans, Philip
dc.contributor.imecauthorJaenen, Patrick
dc.contributor.imecauthorVan Besien, Els
dc.contributor.imecauthorDekkers, Harold
dc.contributor.imecauthorWitters, Thomas
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorVan Ammel, Annemie
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan Besien, Els::0000-0002-5174-2229
dc.contributor.orcidimecDekkers, Harold::0000-0003-4778-5709
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecWitters, Thomas::0000-0002-8528-9469
dc.contributor.orcidimecSwinnen, Bart::0000-0002-6878-7124
dc.date.accessioned2021-10-19T18:03:23Z
dc.date.available2021-10-19T18:03:23Z
dc.date.issued2011-06
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19677
dc.identifier.urlhttp://www.ectc.net/
dc.source.beginpage1384
dc.source.conferenceIEEE 61st Electronic Components and Technology Conference - ECTC
dc.source.conferencedate31/05/2011
dc.source.conferencelocationLake Buena Vista, FL USA
dc.source.endpage1388
dc.title

Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers

dc.typeProceedings paper
dspace.entity.typePublication
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