Browsing by Author "Bailbe, J. P."

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Thermal management in a new ultra-thin chip stack technology

Pinel, S.
;
Tasselli, J.
;
Bailbe, J. P.
;
Marty, A.
;
Marco, S.
;
Morante, J. R.
;
Beyne, Eric
;
Van Hoof, Rita
Proceedings paper
2001, Proceedings of the 2nd Eurosime Conference; 9-11 April 2001; Paris, France., p.269-276
Thermal modeling and management in ultrathin chip stack technology

Pinel, S.
;
Marty, A.
;
Tasselli, J.
;
Bailbe, J. P.
;
Beyne, Eric
;
Van Hoof, Rita
;
Marco, S.
;
Morante, J. R.
Journal article
2002, IEEE Trans. Components and Packaging Technologies, (25) 2, p.244-253
Ultra thin chip vertical integration technique

Pinel, S.
;
Tasselli, J.
;
Lepinois, F.
;
Marty, A.
;
Bailbe, J. P.
;
Beyne, Eric
;
Van Hoof, Rita
;
Marco, S.
Proceedings paper
2001, Conference Proceedings of the 13th European Microelectronics and Packaging Conference & Exhibition; 30 May - 1 June 2001; Stras, p.299-302