Publication:

Thermal modeling and management in ultrathin chip stack technology

Date

2002
Journal article
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Author(s)

Pinel, S.
;
Marty, A.
;
Tasselli, J.
;
Bailbe, J. P.
;
Beyne, Eric  
;
Van Hoof, Rita  
;
Marco, S.
;
Morante, J. R.
;
Vendier, O.
;
Huan, M.

Journal

IEEE Trans. Components and Packaging Technologies

Abstract

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1903 since deposited on 2021-10-14
Acq. date: 2026-04-01

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1903 since deposited on 2021-10-14
Acq. date: 2026-04-01

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