Publication:
Thermal modeling and management in ultrathin chip stack technology
Date
| dc.contributor.author | Pinel, S. | |
| dc.contributor.author | Marty, A. | |
| dc.contributor.author | Tasselli, J. | |
| dc.contributor.author | Bailbe, J. P. | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | Van Hoof, Rita | |
| dc.contributor.author | Marco, S. | |
| dc.contributor.author | Morante, J. R. | |
| dc.contributor.author | Vendier, O. | |
| dc.contributor.author | Huan, M. | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.imecauthor | Van Hoof, Rita | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-14T22:48:44Z | |
| dc.date.available | 2021-10-14T22:48:44Z | |
| dc.date.issued | 2002 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/6725 | |
| dc.source.beginpage | 244 | |
| dc.source.endpage | 253 | |
| dc.source.issue | 2 | |
| dc.source.journal | IEEE Trans. Components and Packaging Technologies | |
| dc.source.volume | 25 | |
| dc.title | Thermal modeling and management in ultrathin chip stack technology | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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