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Browsing by Author "Bock, Daniel"

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    Test strategies for wide-I/O memory, 3D-TSV technology test vehicles and ultra-fine-pitch applications

    Smith, Ken
    ;
    Bock, Daniel
    ;
    Gleeson, Read
    ;
    Jolley, Mike
    ;
    Marinissen, Erik Jan  
    Proceedings paper
    2012-11, IEEE International Workshop on Testing Three-Dimensional Stacked ICs - 3D-TEST, 8/11/2012

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