Browsing by Author "Bouwstra, Siebe"
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Publication Thermo-mechanical design of a generic 0-level MEMS package using chip capping and Through Silicon Via's
Proceedings paper2010, 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics - EuroSimE, 26/04/2010Publication Thermomechanical design and modeling of porous alumina-based thin film packages for MEMS
Proceedings paper2010-04, 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics - EuroSimE, 26/04/2010