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Thermomechanical design and modeling of porous alumina-based thin film packages for MEMS
Publication:
Thermomechanical design and modeling of porous alumina-based thin film packages for MEMS
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Date
2010-04
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Zekry, Joseph
;
Vandevelde, Bart
;
Bouwstra, Siebe
;
Puers, Bob
;
Van Hoof, Chris
;
Tilmans, Harrie
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1861
since deposited on 2021-10-19
Acq. date: 2025-12-11
Citations
Metrics
Views
1861
since deposited on 2021-10-19
Acq. date: 2025-12-11
Citations