Browsing by Author "Bureau, C."
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Publication High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed
;Druais, Gael ;Dilliway, Gabriela ;Fischer, P. ;Guidotti, E. ;Bureau, C.Palmans, RogerMeeting abstract2008, 17th Workshop Materials for Advanced Metallization, 2/03/2008, p.43-44