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Browsing by Author "Bureau, C."

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    High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed

    Druais, Gael
    ;
    Dilliway, Gabriela
    ;
    Fischer, P.
    ;
    Guidotti, E.
    ;
    Bureau, C.
    ;
    Palmans, Roger
    Meeting abstract
    2008, 17th Workshop Materials for Advanced Metallization, 2/03/2008, p.43-44

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