High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed

Publication:

2008

Meeting abstract

Author(s)

Druais, Gael

;

Dilliway, Gabriela

;

Fischer, P.

;

Guidotti, E.

;

Bureau, C.

;

Palmans, Roger

;

1929 since deposited on 2021-10-17

1last month

Acq. date: 2026-05-30