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High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed

Date

2008
Meeting abstract
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dc.contributor.authorDruais, Gael
dc.contributor.authorDilliway, Gabriela
dc.contributor.authorFischer, P.
dc.contributor.authorGuidotti, E.
dc.contributor.authorBureau, C.
dc.contributor.authorPalmans, Roger
dc.contributor.authorRadisic, Alex
dc.contributor.imecauthorRadisic, Alex
dc.date.accessioned2021-10-17T06:57:28Z
dc.date.available2021-10-17T06:57:28Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13678
dc.source.beginpage43
dc.source.conference17th Workshop Materials for Advanced Metallization
dc.source.conferencedate2/03/2008
dc.source.conferencelocationDresden Germany
dc.source.endpage44
dc.title

High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed

dc.typeMeeting abstract
dspace.entity.typePublication
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