Browsing by Author "Cadacio Jr., Francisco"
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Publication An alternative 3D packaging route thru wafer reconstruction
Proceedings paper2015, 17th Electronic Packaging Technology Conference - EPTC, 2/12/2015, p.1-5Publication Evaluation of mechanical stress induced during IC packaging
Proceedings paper2018, Electronic Components and Technology Conference - ECTC, 29/05/2018, p.2162-2167Publication Low warpage wafer level transfer molding post 3D die to wafer assembly
Proceedings paper2016, IEEE 66th Electronic Components and Technology Conference - ECTC, 31/05/2016, p.843-848Publication Reliability of 3D package using wafer level underfill and low CTE epoxy mold compound materials
Proceedings paper2014, 16th IEEE Electronic Packaging Technology Conference - EPTC, 3/12/2014, p.444-448Publication Thermal compression bonding of 20 μm pitch micro bumps with pre-applied underfill – process and reliability
Proceedings paper2015, Electronic Packaging Technology Conference - EPTC, 2/12/2015