Publication:

Low warpage wafer level transfer molding post 3D die to wafer assembly

Date

2016

Proceedings Paper

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Author(s)

Cadacio Jr., Francisco

;

;

Salahouelhadj, Abdellah

;

Capuz, Giovanni

;

Potoms, Goedele

;

Rebibis, Kenneth June

;

;

;

;

;

;

Kersjes, Sebastiaan

;

Statistics

2051 since deposited on 2021-10-23

Acq. date: 2026-02-26