Publication:

Low warpage wafer level transfer molding post 3D die to wafer assembly

Date

2016
Proceedings Paper
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dc.contributor.authorCadacio Jr., Francisco
dc.contributor.authorWang, Teng
dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorPotoms, Goedele
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorGal, Wilfred
dc.contributor.authorZijl, Jurrian
dc.contributor.authorKersjes, Sebastiaan
dc.contributor.authorWensink, Henk
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorPotoms, Goedele
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-23T10:11:06Z
dc.date.available2021-10-23T10:11:06Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26386
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7545526/?arnumber=7545526
dc.source.beginpage843
dc.source.conferenceIEEE 66th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate31/05/2016
dc.source.conferencelocationLas Vegas, NV USA
dc.source.endpage848
dc.title

Low warpage wafer level transfer molding post 3D die to wafer assembly

dc.typeProceedings paper
dspace.entity.typePublication
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