Browsing by Author "Cauwe, Maarten"
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Publication A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels
Proceedings paper2012, 4th Electronics System Integration Technologies Conference - ESTC, 17/09/2012Publication A conformable active matrix LED display
Proceedings paper2015, International Meeting on Information Displays, 18/08/2015Publication A modular and interactive OLED-based lighting system
Journal article2017, LEUKOS. The Journal of the Illuminating Engineering Society, (13) 4, p.211-221Publication A novel 60 GHz wideband coupled half-mode/quarter-mode substrate integrated waveguide antenna
Journal article2017-12, IEEE Transactions on Antennas and Propagation, (65) 12, p.6915-6926Publication A PCB-embedding scheme for LCP ribbon waveguide at D-band
Proceedings paper2018, IEEE/MTT-S International Microwave Symposium - IMS, 10/06/2018, p.382-385Publication Accelerated hermeticity testing of biocompatible moisture barriers used for encapsulation of implantable medical devices
Meeting abstract2017, 5th Advanced Technology Workshop on Microelectronics, Systems and Packaging for Medical Applications, 22/11/2017Publication Accelerated hermeticity testing of biocompatible moisture barriers used for the encapsulation of implantable medical devices
Journal article2019-12, Coatings, (10) 1, p.19Publication Active and passive component embedding into low-cost plastic substrates aimed at smart system application
Proceedings paper2013, International Microelectronics Assembly and Packaging Society - IMAPS US, 1/10/2013Publication Advanced PCB technologies for space and their assessment using up-to-date standards
Journal article2023, CEAS SPACE JOURNAL, (15) 1, p.89-100Publication Biocompatible Hermetic Encapsulation of PMUTs for Usage in Implantable Medical Devices
Proceedings paper2024, 2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium, SEP 22-26, 2024Publication Biocompatible polymers as bi-directional diffusion barriers for hermetic encapsulation of implantable electronics
Meeting abstract2014, International Conferences on Modern Materials and Technologies - CIMTEC, 16/06/2014, p.FO-1:L13Publication Bonding bare die LED's on PET foils for lighting applications: thermal design modeling and bonding experiments
Proceedings paper2012, 4th Electronics System Integration technologies Conference - ESTC, 17/09/2012Publication Challenges in introducing high-density interconnect technology in printed circuit boards for space applications
Journal article2023, CEAS SPACE JOURNAL, (15) 1, p.101-112Publication Comparison of copper electroplating, copper wet etching and linear sweep voltammetry as techniques to investigate the porosity of atomic layer deposited Al2O3
Journal article2019, Thin Solid Films, 686, p.137424Publication Cost-Effective High-Performance Air-Filled SIW Antenna Array for the Global 5G 26 GHz and 28 GHz Bands
Journal article2021, IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS, (20) 2, p.194-198Publication Development of an active high-density transverse intrascicular micro-electrode probe
Journal article2020, Journal of Micromechanics and Microengineering, (30) 1, p.15010Publication Dual-Band (28,38) GHz coupled quarter-mode substrate integrated waveguide antenna array for next generation wireless systems
Journal article2019-04, IEEE Transactions on Antennas and Propagation, (67) 4, p.2405-2412Publication Eco-friendly In-mold Electronics using Polylactic acid
Proceedings paper2024, Conference on Electronics Goes Green (EGG) - From Silicon to Sustainability, JUN 18-20, 2024Publication Embedded passive components for improved power plane decoupling
Proceedings paper2014, 18th IEEE Workshop on Signal and Power Integrity, 11/05/2014Publication Fabrication and characterization of flexible ultrathin chip package using photosensitive polyimide
Journal article2012, IEEE Transactions on Components, Packaging and Manufacturing Technology, (2) 7, p.1099-1106