Adhesion Improvement Between Cu-Etched Commercial Polyimide/Cu Foils and Biopolymers for Sustainable In-Mold Electronics

Abstract

Embedding flexible electronic circuits into a sustainable polymer is an emerging and significant topic in the field of in-mold electronics (IME). Ensuring strong adhesion between the flexible circuit and the molded polymer is critical for the durability of IME products. In this study, three different types of etched copper polyimide (PI) foils were used as the substrate of electronic components. Two bio-based and biodegradable polymers of polylactic acid (PLA) and polyhydroxybutyrate (PHB) served as the overmolding material. Four different surface pretreatments: drying, polydopamine (PDA) coating, PDA coating followed by thermal treatment under vacuum, oxygen plasma, and 3-aminopropyltriethoxysilane (APTES) were applied to the PI surface prior to the overmolding process to investigate the influence on the adhesive strength. Additionally, a thermoplastic polyurethane (TPU) adhesive layer was introduced via vacuum lamination to further improve adhesion. The main objective of this study was to evaluate the adhesive strength between etched PI and overmolded biopolymers before and after surface modifications. The loci of failure were analyzed using scanning electron microscopy (SEM). The results indicate that laminated TPU is the most effective approach for improving adhesion between polyimide foils and biopolymers.