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Browsing by Author "Chang, Timothy"

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    Extreme thinning of Si wafers for via-last and multi wafer stacking applications

    Jourdain, Anne  
    ;
    De Vos, Joeri  
    ;
    Rassoul, Nouredine  
    ;
    Zahedmanesh, Houman  
    ;
    Miller, Andy  
    Proceedings paper
    2018, IEEE 68th Electronic Components and Technology Conference - ECTC, 29/05/2018, p.1-8

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