Publication:

Extreme thinning of Si wafers for via-last and multi wafer stacking applications

Date

2018
Proceedings Paper
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Author(s)

Jourdain, Anne  
;
De Vos, Joeri  
;
Rassoul, Nouredine  
;
Zahedmanesh, Houman  
;
Miller, Andy  
;
Beyer, Gerald  
;
Beyne, Eric  
;
Walsby, Edward  
;
Patel, Jash
;
Ansell, Oliver
;
Ashraf, Huma
;
Thomas, Dave
;
Li, Shifang
;
Chang, Timothy
;
Hiebert, Stephen
;
Cross, Andrew  
;
Stoerring, Moritz

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Abstract

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2046 since deposited on 2021-10-25
Acq. date: 2026-06-23

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2046 since deposited on 2021-10-25
Acq. date: 2026-06-23

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