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    Electro-thermal-mechanical analysis of a HQUAD package for high current and high power application

    Chen, Caroline
    ;
    Oprins, Herman  
    ;
    Vandevelde, Bart  
    ;
    Brizar, Guy
    ;
    Vanderstraeten, Daniel
    Proceedings paper
    2005-09, Proceedings of the International Workshop on Thermal Investigations of ICs and Systems, 28/09/2005, p.173-178

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