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Electro-thermal-mechanical analysis of a HQUAD package for high current and high power application
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Electro-thermal-mechanical analysis of a HQUAD package for high current and high power application
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Date
2005-09
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Chen, Caroline
;
Oprins, Herman
;
Vandevelde, Bart
;
Brizar, Guy
;
Vanderstraeten, Daniel
;
Blansaer, Eddy
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1901
since deposited on 2021-10-16
Acq. date: 2025-12-11
Citations
Metrics
Views
1901
since deposited on 2021-10-16
Acq. date: 2025-12-11
Citations