Browsing by Author "Chen, Cong"
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Publication Detection of bonding voids for 3D integration
Proceedings paper2023, Conference on Metrology, Inspection, and Process Control XXXVII, FEB 27-MAR 02, 2023, p.Art. 124961BPublication Feasibility of detecting and imaging deeply buried voids using GHz Half Wavelength Contact Acoustic Microscopy
Proceedings paper2024, 2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium, 2024-26-22Publication Homogenizing Morphology and Composition of Methylammonium-Free Wide-Bandgap Perovskite for Efficient and Stable Tandem Solar Cells
Publication Suitability of Half-Wavelength Contact Acoustic Microscopy to detect deeply buried voids
Proceedings paper2025, 2025 Conference on Metrology Inspection and Process Control-Annual, 2025-02-24, p.134261M-1-134261M-4Publication The STOIC2021 COVID-19 AI challenge: Applying reusable training methodologies to private data