Browsing by Author "Chen, Kuan-Neng"
Now showing 1 - 3 of 3
- Results per page
- Sort Options
Publication Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test-Part I
Editorial material2025, IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS, 15, 3Publication Guest Editorial: 2.5-D/3-D Chiplet Circuits and Systems, EDA, Advanced Packaging, and TestPart II
Editorial material2025, IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS, 15, 4Publication Investigation of Co thin film as buffer layer applied to Cu/Sn eutectic bonding and UBM with Sn, SnCu, and SAC solders joints
Journal article2017, IEEE Transactions on Components, Packaging and Manufacturing Technology, (7) 11, p.1899-1905