Browsing by Author "Chou, Richard"
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Publication Design And Sign-off Methodologies For Wafer-To-Wafer Bonded 3D-ICs At Advanced Nodes (invited)
Proceedings paper2021-11-04, 23rd ACM/IEEE International Workshop on System-Level Interconnect Pathfinding (SLIP), NOV 04, 2021, p.17-23Publication Design enablement of fine pitch face-to-face 3D system integration using die-by-die place & route
Proceedings paper2019, 2019 International 3D Systems Integration Conference - 3DIC, 8/10/2019, p.1-4