Browsing by Author "Cirigliano, Peter"
Now showing 1 - 2 of 2
- Results Per Page
- Sort Options
Publication A novel plasma-assisted shrink process to enlarge process windows of narrow trenches and contacts for 45-nm node applications and beyond
; ; ; ; Proceedings paper2007, Advances in Resist Materials and Processing Technology XXIV, 25/02/2007, p.65190UPublication Novel patterning shrink technique enabling sub-50nm trench and contact integration
Proceedings paper2007, International Symposium on Semiconductor Manufacturing, 15/10/2007