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Browsing by Author "Claes, D."

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    Novel low thermal budget gate stack solutions for BTI reliability in future Logic Device technologies

    Franco, Jacopo  
    ;
    Arimura, Hiroaki  
    ;
    de Marneffe, Jean-Francois  
    ;
    Vandooren, Anne  
    Proceedings paper
    2021, International Conference on IC Design and Technology (ICICDT), SEP 15-17, 2021
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    Quantum Mechanical Charge Trap Modeling to Explain BTI at Cryogenic Temperatures

    Michl, J.
    ;
    Grill, A.
    ;
    Claes, D.
    ;
    Rzepa, G.
    ;
    Kaczer, B.
    ;
    Linten, D.
    ;
    Radu, I
    ;
    Grasser, T.
    ;
    Waltl, M.
    Proceedings paper
    2020, IEEE International Reliability Physics Symposium (IRPS), APR 28-MAY 30, 2020

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