Browsing by Author "Claes, D."
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Publication Novel low thermal budget gate stack solutions for BTI reliability in future Logic Device technologies
Proceedings paper2021, International Conference on IC Design and Technology (ICICDT), SEP 15-17, 2021Publication Quantum Mechanical Charge Trap Modeling to Explain BTI at Cryogenic Temperatures
;Michl, J. ;Grill, A. ;Claes, D. ;Rzepa, G. ;Kaczer, B. ;Linten, D. ;Radu, I ;Grasser, T.Waltl, M.Proceedings paper2020, IEEE International Reliability Physics Symposium (IRPS), APR 28-MAY 30, 2020