Browsing by Author "Cosemans, P."
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Publication Dynamics of electromigration induced void-hillock growth and precipitation/dissolution of addition elements studied by in-situ electron microscopy resistance measurements
Journal article1999, Microelectronics and Reliability, (39) 11, p.1617-1630Publication Electromigration-induced drift in damascene and plasma-etched Al(Cu). I: Kinetics of Cu depletion in polycrystalline interconnects
Journal article2000, Journal of Applied Physics, (87) 1, p.86-98Publication Stress relaxation in Al(Cu) thin films
Journal article1997, Microelectronic Engineering, 33, p.137-147Publication Stress relaxation in Al-Cu and Al-Si-Cu thin films
Journal article1999, J. Materials Research, (14) 4, p.1246-1254Publication Study of Cu diffusion in an Al-1%Si-0.5%Cu bond pad with an Al-1%Si bond wire attached using scanning electron microscopy
Journal article1998, Microelectronics Reliability, (38) 3, p.309-315Publication Thin nanocrystalline CVD diamond films based on nanodiamond / TiO2 sol-gel composites
Meeting abstract2009, Innovations in Thin Films Processing and Characterisation - ITFPC, 17/11/2009