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Electromigration-induced drift in damascene and plasma-etched Al(Cu). I: Kinetics of Cu depletion in polycrystalline interconnects
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1871 since deposited on 2021-10-14
Acq. date: 2025-12-10
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Views
1871 since deposited on 2021-10-14
Acq. date: 2025-12-10
Citations