Browsing by Author "Crook, Kath"
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Publication Direct Bonding Using Low Temperature SiCN Dielectrics
Proceedings paper2022, 72nd IEEE Electronic Components and Technology Conference (ECTC), MAY 31-JUN 01, 2022, p.602-607Publication Impact of backside processing on C-V characteristics of TSV capacitors in 3D stacked IC process flows
Proceedings paper2015, 17th Electronics Packaging Technology Conference - EPTC, 2/12/2015, p.1-4