Publication:

Direct Bonding Using Low Temperature SiCN Dielectrics

Date

2022

Proceedings Paper

https://doi.org/10.1109/ECTC51906.2022.00101

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Author(s)

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Channam, Venkat Sunil Kumar

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Buchanan, Keith

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Vanstreels, Kris

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Phommahaxay, Alain

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Journal

na

Statistics

1387 since deposited on 2022-09-17

Acq. date: 2026-06-24