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Direct Bonding Using Low Temperature SiCN Dielectrics
Publication:
Direct Bonding Using Low Temperature SiCN Dielectrics
Date
2022
Proceedings Paper
https://doi.org/10.1109/ECTC51906.2022.00101
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Iacovo, Serena
;
Nagano, Fuya
;
Channam, Venkat Sunil Kumar
;
Walsby, Edward
;
Crook, Kath
;
Buchanan, Keith
;
Jourdain, Anne
;
Vanstreels, Kris
;
Phommahaxay, Alain
;
Beyne, Eric
Journal
na
Abstract
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1382
since deposited on 2022-09-17
Acq. date: 2025-10-25
Citations
Metrics
Views
1382
since deposited on 2022-09-17
Acq. date: 2025-10-25
Citations