Publication:

Direct Bonding Using Low Temperature SiCN Dielectrics

Date

2022
Proceedings Paper
https://doi.org/10.1109/ECTC51906.2022.00101
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dc.contributor.authorIacovo, Serena
dc.contributor.authorNagano, Fuya
dc.contributor.authorChannam, Venkat Sunil Kumar
dc.contributor.authorWalsby, Edward
dc.contributor.authorCrook, Kath
dc.contributor.authorBuchanan, Keith
dc.contributor.authorJourdain, Anne
dc.contributor.authorVanstreels, Kris
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorIacovo, Serena
dc.contributor.imecauthorNagano, Fuya
dc.contributor.imecauthorChannam, Venkat Sunil Kumar
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecIacovo, Serena::0000-0002-0826-9165
dc.contributor.orcidimecNagano, Fuya::0000-0001-5315-8694
dc.contributor.orcidimecChannam, Venkat Sunil Kumar::0000-0003-2034-4313
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2023-04-28T10:17:08Z
dc.date.available2022-09-17T02:52:07Z
dc.date.available2023-04-28T10:17:08Z
dc.date.issued2022
dc.identifier.doi10.1109/ECTC51906.2022.00101
dc.identifier.eisbn978-1-6654-7943-1
dc.identifier.issn0569-5503
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40441
dc.publisherIEEE
dc.source.beginpage602
dc.source.conference72nd IEEE Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateMAY 31-JUN 01, 2022
dc.source.conferencelocationSan Diego
dc.source.endpage607
dc.source.journalna
dc.source.numberofpages6
dc.title

Direct Bonding Using Low Temperature SiCN Dielectrics

dc.typeProceedings paper
dspace.entity.typePublication
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