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Browsing by Author "Cui, Hua"

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    TiN metal hardmask etch residues removal on advanced porous low-k and Cu device with corner rounding scheme

    Cui, Hua
    ;
    Claes, Martine  
    ;
    Suhard, Samuel  
    Meeting abstract
    2010, 10th International Symposium on Ultra-Clean Processing of Semiconductor Devices - UCPSS, 19/09/2010, p.178-179

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