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Conference contributions
TiN metal hardmask etch residues removal on advanced porous low-k and Cu device with corner rounding scheme
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TiN metal hardmask etch residues removal on advanced porous low-k and Cu device with corner rounding scheme
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Date
2010
Meeting abstract
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21239.pdf
261.87 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Cui, Hua
;
Claes, Martine
;
Suhard, Samuel
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Abstract
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since deposited on 2021-10-18
Acq. date: 2025-12-17
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since deposited on 2021-10-18
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Acq. date: 2025-12-17
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Downloads
1
since deposited on 2021-10-18
Acq. date: 2025-12-17
Views
1864
since deposited on 2021-10-18
1
last month
Acq. date: 2025-12-17
Citations