Browsing by Author "D'havé, Koen"
Now showing 1 - 2 of 2
- Results per page
- Sort Options
Publication Backside Power Delivery With Relaxed Overlay for Backside Patterning Using Extreme Wafer Thinning and Molybdenum-Filled Slit Nano Through Silicon Vias
Journal article2024, IEEE TRANSACTIONS ON ELECTRON DEVICES, (71) 12, p.7963-7969Publication Wafer to Wafer Hybrid Bonding Pitch Scaling Challenges (Invited)
Proceedings paper2026, IEEE International Reliability Physics Symposium (IRPS), 2026-03-22, p.1-9