Browsing by Author "De Baets, J."
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Publication A new approach to flip chip on board technology using SMT compatible processes
Journal article1999, Microelectronics International, (16) 3, p.39-42Publication A new cost-effective TAB technology for small and medium volumes
Proceedings paper1995, Proceedings of the 10th European Microelectronics Conference; May 1995; Copenhagen, Denmark., p.547-558Publication A two-layer high density printed circuit board and its reliability
Journal article1999, Microelectronics and Reliability, (39) 9, p.1337-1341Publication Custom design and system integration
Publication Design of an x-Si Aactive matrix for high resolution reflective displays
Proceedings paper1995, Proceedings of the 15th International Display Research Conference. Asia Display 1995; October 1995; Hamamatsu, Japan., p.477-479Publication Electroless nickel-gold stud bumping on laminate for flip-chip assembly
; Publication High density thick film multilayers with Ag-based conductors
Proceedings paper1998, Proceedings IMAPS International Symposium on Microelectronics, 1/11/1998, p.789-794Publication Low cost high density multilayer interconnection technology
Proceedings paper1998, Proceedings of the 3rd European Conference on Electronic Packaging Technology and 9th International Conference on Interconnectio, 15/06/1998, p.129-133Publication Low cost high-density multilayer circuits for MCM-C
Proceedings paper1999, Proceedings of the 5th European Conference on Multichip Modules; February 1999; London, UK., p.21-26Publication Low cost high-density multilayer circuits for MCM-C
Journal article1999, Microelectronics International (Hybrid Circuits), (16) 2, p.55-58Publication New model for the characterization and simulation of TFTs in all operating regions
; ; ; Journal article1995, Journal of the Society for Information Display, (3) 3, p.119-125Publication Photovia technology: some important aspects for reliability
Proceedings paper1999, Proceedings of the IMAPS; October 1999; Chicago, USA., p.240-245Publication Stabilizer concentration and local environment: their effects on electroless nickel plating of PCB micropads
Journal article1999, J. Electrochem. Soc., (146) 8, p.2870-2875Publication Technology and circuit aspects of reflective PNLC microdisplays
Proceedings paper1997, Proceedings of the 17th International Display Research Conference 1997; Toronto, Canada; September 1997., p.195-198Publication The fabrication and reliability of a photovia test vehicle for MCM-L applciations
Proceedings paper1998, Proceedings IMAPS International Symposium on Microelectronics, 1/11/1998, p.53-58Publication The realisation of photo-via technology using multiposit as a photo imageable dielectric
Proceedings paper1998, Proceedings of the 3rd European Conference on Electronic Packaging Technology and 9th International Conference on Interconnectio, 15/06/1998, p.62-65