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Electroless nickel-gold stud bumping on laminate for flip-chip assembly
Publication:
Electroless nickel-gold stud bumping on laminate for flip-chip assembly
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Date
1997
Presentation
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Zang, S.
;
Vereecken, M.
;
De Baets, J.
;
Van Calster, Andre
;
Vervaet, A.
;
Peeters, Joris
;
Allaert, K.
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Abstract
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2008
since deposited on 2021-09-30
Acq. date: 2026-01-26
Citations
Statistics
Views
2008
since deposited on 2021-09-30
Acq. date: 2026-01-26
Citations