Publication:
Electroless nickel-gold stud bumping on laminate for flip-chip assembly
Date
| dc.contributor.author | Zang, S. | |
| dc.contributor.author | Vereecken, M. | |
| dc.contributor.author | De Baets, J. | |
| dc.contributor.author | Van Calster, Andre | |
| dc.contributor.author | Vervaet, A. | |
| dc.contributor.author | Peeters, Joris | |
| dc.contributor.author | Allaert, K. | |
| dc.contributor.imecauthor | Van Calster, Andre | |
| dc.date.accessioned | 2021-09-30T10:10:33Z | |
| dc.date.available | 2021-09-30T10:10:33Z | |
| dc.date.issued | 1997 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/2320 | |
| dc.source.conference | Printed Circuit Board Technology; January 1997; Berlin, Germany. | |
| dc.source.conferencelocation | ||
| dc.title | Electroless nickel-gold stud bumping on laminate for flip-chip assembly | |
| dc.type | Oral presentation | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |