Browsing by Author "Debecker, Bjorn"
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Publication Challenges in BEOL design and materials coping with CPI stress issues for advanced packaging solutions
Meeting abstract2013, Materials for Advance Metallization - MAM, 10/03/2013, p.203-204Publication Chip package interaction (CPI): thermo mechanical challenges in 3D technologies
Proceedings paper2012, 14th Electronics Packaging Technology Conference - EPTC, 5/12/2012Publication Chip-package interaction
Oral presentation2013, IEEE International Reliability Physics Symposium - IRPSPublication Chip-package interaction in 3D stacked IC packages using finite element modelling
Journal article2014, Microelectronics Reliability, (54) 6_7, p.1200-1205Publication Delamination in BEOL: analysis of interface failure by combined experimental & modeling approaches
Proceedings paper2013, IEEE International Reliability Physics Symposium - IRPS, 14/04/2013, p.5C.2Publication IC-package interaction
Proceedings paper2013, IEEE Int. Conf on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsyst. - EuroSimE, 14/04/2013Publication Second level joint failures due to excessive warpage of advanced IC packages
Meeting abstract2013, Materials for Advanced Metallization - MAM, 10/03/2013, p.165-166Publication Strength analysis of advanced node BEOL under CPI induced stresses
Proceedings paper2013, IEEE Int. Conf on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsyst. - EuroSimE, 15/04/2013