Browsing by Author "Dehan, Morin"
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Publication A 4.5 kV HBM, 300 V CDM, 1.2 kV HMM ESD protected DC-to-16.1 GHz wideband LNA in 90 nm CMOS
Proceedings paper2009, 31st Annual EOS/ESD Symposium, 30/08/2009, p.5A.6Publication A 60-GHz LNA and a 92-GHz low-power distributed amplifier in CMOS with above-IC
Proceedings paper2008, 3rd European Microwave Integrated Circuits Conference, 27/10/2008, p.250-253Publication A compact wideband front-end using a single-inductor dual-band VCO in 90 nm digital CMOS
Publication A low cost 90nm RF-CMOS platform for record RF circuit performance
Proceedings paper2005-06, Symposium on VLSI Technology. Digest of Technical Papers, 14/06/2005, p.60-61Publication A plug-and-play wideband RF circuit ESD protection methodology: T-diodes
Journal article2009, Microelectronics Reliability, (49) 12, p.1440-1446Publication Advanced planar bulk and multigate CMOS technology: analog circuit benchmarking up to mm-wave frequencies
Proceedings paper2008, IEEE International Solid-State Circuits Conference - ISSCC, 3/02/2008, p.528-529Publication An accurate scalable compact model for the substrate resistance of RF MOSFETs
Proceedings paper2007-09, IEEE Custom Integrated Circuits Conference - CICC, 16/09/2007, p.503-506Publication Analysis of the FinFET parasitics for improved RF performances
Proceedings paper2007-10, IEEE International SOI Conference, 1/10/2007, p.37-38Publication Analytical extraction of small and large signal models for FINFET varactors
Journal article2008, Solid-State Electronics, (52) 5, p.704-710Publication Characterization, modeling, and optimization of FinFET MOS varactors
Proceedings paper2007-01, Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 10/01/2007, p.28-31Publication Circuit and product level assessment of emerging fully depleted channel devices: FinFET and UTBOX-SOI
Proceedings paper2012, CMOS Emerging Technologies Conference, 18/07/2012Publication CMOS technology development vehicle for bulk FinFET N10/N7
Oral presentation2013, 9th International Nanotechnology Conference on Communication and Cooperation - INC9Publication Design issues and cosiderations for low-cost 3D TSV IC technology
Proceedings paper2010, IEEE International Solid-State Circuits Conference - ISSCC, 8/02/2010, p.148-149Publication Design technology co-optimization for N10
Proceedings paper2014, IEEE Proceedings of the Custom Integrated Circuits Conference - CICC, 15/09/2014, p.1-8Publication Design, verification and simulation of 3D circuit
Oral presentation2009, Design, Automation and Test in Europe Conference - DATE: Workshop on 3D Integration (W5)Publication Device and circuit-level analog performance trade-offs: a comparative study of planar bulk FETs versus FinFETs
Proceedings paper2005, Technical Digest International Electronic Devices Meeting - IEDM, 5/12/2005, p.36-5-1-36-5-4Publication EUV single patterning for logic metal layers: achievement and challenge
Proceedings paper2017, International Conference on Extreme Ultraviolet Lithography, 17/09/2017, p.1045004Publication FinFET RF receiver building blocks operating above 10 GHz
Proceedings paper2009-09, 39th European Solid-State Device Research Conference - ESSDERC, 14/09/2009, p.347-350Publication FinFET technology for analog and RF circuits
Proceedings paper2007-12, 14th IEEE International Conference on Electronics, Circuits and Systems - ICECS, 11/12/2007, p.182-185Publication FinFET technology for analog/RF and mmwave applications
Dehan, MorinOral presentation2013, IMS Workshop
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