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Design issues and cosiderations for low-cost 3D TSV IC technology
Publication:
Design issues and cosiderations for low-cost 3D TSV IC technology
Date
2010
Proceedings Paper
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19408.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Van der Plas, Geert
;
Limaye, Paresh
;
Mercha, Abdelkarim
;
Oprins, Herman
;
Torregiani, Cristina
;
Thijs, Steven
;
Linten, Dimitri
;
Stucchi, Michele
;
Guruprasad, Katti
;
Velenis, Dimitrios
;
Shinichi, Domae
;
Cherman, Vladimir
;
Vandevelde, Bart
;
Simons, Veerle
;
De Wolf, Ingrid
;
Labie, Riet
;
Perry, Dan
;
Bronckers, Stephane
;
Minas, Nikolaos
;
Cupak, Miroslav
;
Ruythooren, Wouter
;
Van Olmen, Jan
;
Phommahaxay, Alain
;
de Potter de ten Broeck, Muriel
;
Opdebeeck, Ann
;
Rakowski, Michal
;
De Wachter, Bart
;
Dehan, Morin
;
Nelis, Marc
;
Agarwal, Rahul
;
Dehaene, Wim
;
Travaly, Youssef
;
Marchal, Pol
;
Beyne, Eric
Journal
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1967
since deposited on 2021-10-18
Acq. date: 2025-10-23
Citations
Metrics
Views
1967
since deposited on 2021-10-18
Acq. date: 2025-10-23
Citations