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Publication:

Design issues and cosiderations for low-cost 3D TSV IC technology

Date

2010
Proceedings Paper
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19408.pdf 4.4 MB

Author(s)

Van der Plas, Geert  
;
Limaye, Paresh
;
Mercha, Abdelkarim  
;
Oprins, Herman  
;
Torregiani, Cristina
;
Thijs, Steven  
;
Linten, Dimitri  
;
Stucchi, Michele  
;
Guruprasad, Katti
;
Velenis, Dimitrios  
;
Shinichi, Domae
;
Cherman, Vladimir  
;
Vandevelde, Bart  
;
Simons, Veerle  
;
De Wolf, Ingrid  
;
Labie, Riet  
;
Perry, Dan
;
Bronckers, Stephane
;
Minas, Nikolaos
;
Cupak, Miroslav  
;
Ruythooren, Wouter  
;
Van Olmen, Jan  
;
Phommahaxay, Alain  
;
de Potter de ten Broeck, Muriel  
;
Opdebeeck, Ann  
;
Rakowski, Michal  
;
De Wachter, Bart  
;
Dehan, Morin
;
Nelis, Marc
;
Agarwal, Rahul
;
Dehaene, Wim  
;
Travaly, Youssef
;
Marchal, Pol
;
Beyne, Eric  

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1967 since deposited on 2021-10-18
Acq. date: 2025-10-23

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1967 since deposited on 2021-10-18
Acq. date: 2025-10-23

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