Browsing by Author "Dewilde, Sven"
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Publication ALD barrier deposition on porous low-k dielectric materials for interconnects
Proceedings paper2011, Atomic Layer Deposition Applications 7, 9/10/2011, p.25-32Publication Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies and Bond Pad Pitch Scaling Down to 2 μm
Proceedings paper2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.40-44Publication Mitigating Connected PAD Corrosion in Hybrid Bonding
Proceedings paper2025, IEEE 27th Electronics Packaging Technology Conference (EPTC), 2025-12-02, p.1-6Publication Scaling Cu/SiCN Wafer-to-Wafer Hybrid Bonding down to 400 nm interconnect pitch
; ; ; ; ; Proceedings paper2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.312-318Publication Self-formed Barrier using Cu-Mn Alloy Seed applied to a 400nm Pitch Wafer-to-Wafer Hybrid Bonding Technology
Proceedings paper2025, IEEE 75th Electronic Components and Technology Conference (ECTC), 2025-05-27, p.341-346Publication The Challenges and Solutions of Cu/SiCN Wafer -to Wafer Hybrid Bonding Scaling Down to 400nm Pitch
Proceedings paper2023, International Electron Devices Meeting (IEDM), 2023-12-09Publication Wafer-to-Wafer Hybrid Bonding Technology with 300nm Interconnect Pitch
Proceedings paper2025, IEEE 75th Electronic Components and Technology Conference (ECTC), 2025-03-27, p.554-558Publication Wet-chemical Cu Cleaning for Fine-Pitch Hybrid Bonding
Proceedings paper2025, IEEE 75th Electronic Components and Technology Conference (ECTC), 2025-05-27, p.1859-1863