Browsing by Author "Dewilde, Sven"
Now showing 1 - 5 of 5
- Results per page
- Sort Options
Publication ALD barrier deposition on porous low-k dielectric materials for interconnects
Proceedings paper2011-10, Atomic Layer Deposition Applications 7, 9/10/2011, p.25-32Publication Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies and Bond Pad Pitch Scaling Down to 2 μm
Proceedings paper2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.40-44Publication Scaling Cu/SiCN Wafer-to-Wafer Hybrid Bonding down to 400 nm interconnect pitch
; ; ; ; ; Proceedings paper2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.312-318Publication Wafer-to-Wafer Hybrid Bonding Technology with 300nm Interconnect Pitch
Proceedings paper2025, IEEE 75th Electronic Components and Technology Conference (ECTC), 2025-03-27, p.554-558Publication Wet-chemical Cu Cleaning for Fine-Pitch Hybrid Bonding
Proceedings paper2025, IEEE 75th Electronic Components and Technology Conference (ECTC), 2025-05-27, p.1859-1863